Inspection capabilities

Our individually programmed automation modules can be used singularly or in combination with each other to fulfill specific inspection capabilities.

2D inspection

The purpose of inspecting 2D images ranges from specific manual or algorithmic inspection tasks (e.g. CD measurements) up to automatic anomaly detection by comparing chip structures against a pre-trained golden chip reference model.

3D inspection

The purpose of inspecting 3D surface measurement profiles ranges from specific algorithmic inspection tasks, such as controlling specific height and depth thresholds, as well as anomaly detection by comparing a 3D profile against pre-trained thresholds.

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  • Automation

    The product portfolio of PVA SPA Software Entwicklungs GmbH implies fully automatic systems for quality control of semiconductor frontend and backend products. By the usage and ongoing development of image analysis modules we offer automatic optical inspections of wafers on 2D images and also high precision 3D surface profiles. Our customer-focused approach allows us to provide the exact solution customers are looking for.

    Alignment/Referencing module

    •  Automatic wafer alignment and referencing with image processing license
    • Manual wafer alignment and referencing fallback
    • Optional wafer edge and flat/notch profiling

    Bump & Ball inspection AOI package

    • automatic 3D profiling of bumps and balls
    • threshold definition for top, medium and lower bump/ball surface measurement
    • adjustable magnification (if lens changer exists)
    • Inspection result output in wafermap or in CSV result file
    • Usage of sample inspection algorithms possible
      • Third dimension resolution: 5 - 50nm (depending on material)
      • Lateral resolution: 0,5 – 8µm/px (depending on used objective lens)

    Chip Reference Model AOI package

    • Chip-to-chip comparison (fixed RM training per wafer type), support for different zones with different weights
    • Chip-to-chip comparison without type-dependent image processing script (dynamic RM training per wafer)
    • Support for sample measurement (configurable percentage)
    • Programming robust RM inspection scripts for 5 different types of wafers
    • Integrated VSE (Visual Script Editor) for analysis and script programming

    Critical Dimension (CD) AOI package

    • Programmable distance measurements with automatic edge detection using PVA SPA scripting language
    • Product-specific linking of CD programs in recipes
    • Usage of sample inspection algorithms possible

    Inkdot inspection script AOI package

    • 100% inkdot quality assurance
    • Ink splash detection on good dies
    • Automatic reinking of inkdot failures
    • Inkdot size (min/max) control
    • Inkdot position control
    • Inkdot shape control (roundness, aspect ratio)
    • Ink on pass chip detection
    • Individual inspection parameters for edge dies

    Probemark inspection AOI package

    • 2D distance control of scrub to pad edges
    • Surface area control of scrub within pad (in %)
    • Optional 3D profiling of scrub depth and height
    • Usage of sample inspection algorithms possible
      • Third dimension resolution: 5 - 50nm (depending on material)

    Lateral resolution: 0,5 – 8µm/px (depending on used objective lens)

    Sawing inspection AOI package

    • Die-to-die distance measurement on top sawing edge
    • Die-to-die distance measurement on bottom sawing edge
    • Sawing edge to chip sealring distance measurement
    • Chip size measurement on top sawing edge
    • Chip size measurement on bottom sawing edge
    • Chip tilt comparison to xy alignment
    • Sawing street profile in 3D with interface to MountainsMap application
      • Third dimension resolution: 5 - 50nm (depending on material)
      • Lateral resolution: 0,5 – 8µm/px (depending on used objective lens)
  • Manual operation

    The product portfolio of PVA SPA Software Entwicklungs GmbH implies manually operated systems for quality control of semiconductor frontend and backend products. By the usage and ongoing development of our software modules we offer semi-automatic workflow sequences for increasing the operator inspection efficiency. Our customer-focused approach allows us to provide the exact solution customers are looking for.

    Wafermapedit module

    • Chip classification in the map thru keypad and/or mouse
    • Rubberband selection of chips with the mouse rectyangular and polygon for synchronous classification
    • Temporary lock of the map as intermediate result and reopening of the inspection later on

    Alignment/Referencing module

    • Manual wafer alignment and referencing
    • Applicable for manual or motorized xy tables
    • Optional wafer edge and flat/notch profiling

    KLARF import / review / export module

    • KLA result file (KLARF) import
    • KLA result file (KLARF) defect review
    • Supporting KLARF Version 1.2
    • Supporting several defects per chip
    • Table/list of defects within a chip
    • Stage movement onto selected defects
    • Support of error classes
    • Reclassify error classes
    • TIFF conversion for defect images
    • Process support for image acquisition (manual, semi-automatic, automatic)
    • Automatic deleting of KLARF and image data after n days on computer
    • Automatic calculation of the magnification for defect image acquisition
    • KLA result file (KLARF) export without data loss

    Sample inspection algorithm package

    • Preconditions: Wafermap import converter and motorized xy table
    • Chip prepositioning
    • Defined list of positions per chip and wafer
    • Chip-coordinate-fine inspection algorithm (Sample, AQL, LTPD, edge, 100%)
    • Move to Chip thru mouse-click in the mapdisplay with adjustable relative offset in chip

    Inspection reports

    • Customer specific lot reports (.txt, .csv, .xml)
    • KLA result file report

    Customized inspection for quality assurance

    • Bincode defect review stepping and reclassification
    • Individual wafer- and chip sampling routines for front- and backside of diced wafer on frame
    • Project specific developments

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PVA SPA Software Entwicklungs GmbH
Seifartshofstraße 12-14
96450 Coburg, Germany

Phone: +49 (0) 9561 7947-0

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