Enhanced Optical System
The LuXpector EOS (Enhanced Optical System) uses high-precision optics with a very fast autofocus to quickly and reliably inspect wafers up to 300 mm in size. Microscopic defects are automatically detected on wafer top- and backside surfaces. The affected chips are marked as fail chips for further processing within the fab. A dual-arm robot handles up to three wafers simultaneously in the system, ensuring a smooth handling process. Our PVA Data Gateway serves as online-remote interface for industry 4.0 demands.
Enhanced Backside Inspection System
The LuXpector EBIS (Enhanced Backside Inspection System) uses two high-resolution CIS scan lines to capture images of the front- and backside of wafers simultaneously. Before starting the scanning process, a wide variety of parameters, such as e.g. white balance, hue, saturation, and many more can be set up and saved as wafer recipe individually. The scan images will be saved in a data storage and defects found during the scanning process can be marked automatically by image analysis or manually by an operator on an external review PC. The defects on both sides of the wafer will be merged effortlessly into one wafer map, marking all defects as fail dies for further processing within your fab.
Purpose of UL200 wafer loader
The UL200 is a compact table system with a small footprint for fast automatic loading of wafers with a diameter of up to 200 mm onto a microscope either provided by us or the customer's own. This automation eliminates the need for operators to manually remove wafers from cassettes, significantly reducing the risk of damage and enhancing production efficiency.
